| Description | Technical Parameters | Remark | |
|---|---|---|---|
| Layer | 1-40 | ||
| Board Material | FR4, High Tg, Aluminum Base, High Frequency, Rogers,PTFE,FPC,Thick Copper, Paper Base, BT Base, PI Base, Rogers, Arlon, Nelco | ||
| Product type | Back board, HDI, Blind/Burried vias multilayer, Capacitor Embedded board, Power supply, Thick gold, Thick copper board, etc. | ||
| Min Trace/Space | 0.050mm(2mils) | Finished copper weight 0.5 OZ | |
| Min. Annular Ring Width | Vias: 3mils | ||
| Component Holes: 5mils | |||
| Min. Hole Size | NC drill | 0.10mm(4mil) | Finished boards |
| Laser drill | 0.10mm(4mil)(Depth≤65um) | ||
| Aspect Ratio | 16:1 | ||
| Max. Board thickness | Single and Double Side | 8.0mm | |
| Multilayer | 8.0mm | ||
| Min. Board Thickness | Single and Double Side | 0.2mm | |
| Multilayer |
4Layer: 0.40mm 6Layer: 0.60mm 8Layer: 1.00mm 10layer: 1.20mm |
||
| Max. Board size | Single and Double Side | 609 * 609mm | |
| Multilayer | 550 * 810mm | ||
| Distance Between Trace and Board edge | Outline: 0.20mm | ||
| V-CUT:0.33mm(Board Thickness<1.2mm) | |||
| Solder mask | Mask Window(mil) | 2/4 | |
| Mask Bridge(mil) | 6 | Between IC pins | |
| Color | White, Black, Blue, Green, Yellow, Red | ||
capability
